The dual station laser splitter is a precision equipment developed by our company based on market demand, mainly used for cutting the shape and splitting of FPC and PCB products. The equipment consists of a laser cutting mechanism, a cutting positioning mechanism, a cutting dust removal mechanism, and a cutting platform mechanism. It can be quickly and easily manually adjusted to cut various products of different lengths and widths.
The dual station laser splitter has the characteristics of strong compatibility, high cutting accuracy, fast speed, good stability, and compact equipment size. The software and hardware are independently developed by our company, and the operation is simple and convenient.
Equipment appearance: length 1600mm X width 1600mm X height 1720mm
Equipment parameters
Equipment name | Dual station laser splitting machine |
model | WXR-220UD |
laser device | Ultraviolet nanosecond 20W |
Cutting format | 350mmx500mm |
Number of platforms | Dual Platform |
Applicable product types | PCB |
comprehensive accuracy | ±0.025mm |
Loading and unloading methods | Manual loading and unloading of materials |
Support reading file types | DXF, etc |
operating system | WIN10 |
Equipment weight | About 2.5 tons |
Application area
Semiconductors, integrated circuits, communications, lighting, etc
Application object
LCP, MPI, PI, FR4, FR5, and CEM, as well as polyester materials, ceramic materials, and other RF materials